Electronics and Computer Engineering

Electronic Packaging

Integrated course, 4.00 ECTS

 

Course content

- Levels of electronic packaging (chip, board, device)
- Chip-level packaging
- Board-level packaging
- PCB design with Altium
- Model design of a small power supply circuit including commissioning
and test
- Aspects of manufacturability, EMI, cooling
- Compact enclosures for electronic equipment

Learning outcomes

Graduates
- are familiar with the various aspects of electronic hardware development
- are able to design, build and test power electronic circuits
- are proficient in the fundamentals of analog circuit design
- are able to develop digital designs in VHDL

Recommended or required reading and other learning resources / tools

Books:
- Altium Designer Tutorial
- QU, Liu: Wafer-level Chip-scale Packaging
- Elison: Thermal Computations for Electronics
- Shabany: Thermal Management of Electronics
- Mohan: Power Electronics
- Horowitz, Hill: The Art of Electronics
- Analog Devices: Linear Circuit Design Handbook
- Texas Instruments: Noise Analysis in Operational Amplifier Circuits
- Boylestad, Nashelsky: Electronic Devices and Circuit Theory - Johnson, Graham: High-Speed Digital Design - Analog-Devices:High Speed Design Technique
- Rushton: VHDL for Logic Synthesis
- Perry: VHDL
- Crouch: Design for Test
- Martin, Ho: Digital Integrated Circuit Design
- Katz, Borriello: Contemporary Logic Design
- Plummer, Deal, Griffin: Silicon VLSI Technology: Fundamentals, Practice,
and Modeling
Journals:
- European Power Electronic Conference
- - Xilinx: Xcell journal

Mode of delivery

Integrated course

Prerequisites and co-requisites

Bachelor’s degree programme

Assessment methods and criteria

Continuous assessment